Features
Specifications
| Main Specifications | |
| CPU |
12th Generation Intel® Core™, TDP Max. 65W Intel® Core™ i9-12900TE/i9-12900E Intel® Core™ i7-12700TE/i7-12700E Intel® Core™ i5-12500TE/i5-12500E Intel® Core™ i3-12100TE/i3-12100E 13th Generation Intel® Core™, TDP Max. 65W Intel® Core™ i9-13900TE/i9-13900E Intel® Core™ i7-13700E Intel® Core™ i5-13500E Intel® Core™ i3-13100TE 14th Generation Intel® Core™, TDP Max. 65W Intel® Core™ i9-14900/i9-14900T Intel® Core™ i7-14700/i7-14700T Intel® Core™ i5-14500 Intel® Core™ i3-14100/i3-14100T |
| Chipset | Q670E |
| System Memory | DDR5 4800Mhz U-DIMM x 4, up to 128GB |
| Display Interface |
HDMI x 2 (Type-A) Display Port x 2 |
| Storage Device |
2.5” SATA Drive Bay x 2 (external, swappable) M.2 2280 M-Key x 2 (PCIe Gen 4 [x4]) 3.5” SATA Drive Bay (internal, non-swappable, optional) |
| Ethernet |
2.5GbE x 3 (Intel® I226-IT) GbE x 1 with LED Indicator (Intel® I219-LM) |
| I/O |
HDMI x 2, Display Port x 2 RJ-45 x 4 3.2 Gen 2 x 8 (Type-A) DB-9 Male x 6 for RS-232/422/485 (Autoflow, Programmable) DB-15 Male x 1 for 8-bit DIO Audio (Mic-in/Line-out) DC 19 ~ 36V 3-pin Terminal Block Connector Power Button with LED x 1 Remote Power On/Off x 1 Reset Button x 1 |
| Expansion |
M.2 2230 E-Key x 1 M.2 3052 B-Key w/SIM x 1 M.2 2280 M-Key/B+M-Key x 2 Full-Size Mini Card x 1 (PCIe + USB) A1: PCIE [x4] x 1 + PCIE [x16] x 1 A2: PCIE [x4] x1 + PCIE [x8] (in x16 slot) x 2 Max. Power Consumption of GPU card 300W Max. Size of GPU card 305mm x 120mm x 50mm |
| Indicator | — |
| OS support |
Windows® 10 IoT Enterprise LTSC 2021 Windows® 11 Pro Linux Ubuntu 22.04 |
| Power Supply | |
| Power Requirement | DC 19~36V 3-pin Terminal Block |
| Mechanical | |
| Mounting | Wallmount |
| Dimensions (W x H x D) |
7.35’’ x 8.92’’ x 14.76’’ (186.8 x 226.5 x 375 mm)(Without brackets) 7.35’’ x 9.19’’ x 16.50’’ (186.8 x 233.5 x 419 mm)(With brackets) |
| Gross weight | 20.9 lb (9.5Kg) |
| Net Weight | 18.1 Ib (8.2 Kg) |
| Environmental | |
| Operating Temperature |
-4°F ~ 113°F (-20°C ~ 45°C), according to IEC68-2 with 0.5 m/s AirFlow (w/ Industrial wide Temp. SSD/RAM) |
| Storage Temperature | -40°F ~ 176°F (-40°C ~ 80°C) |
| Storage Humidity | 5 ~ 95% @ 40°C, non-condensing |
| Anti-Vibration | 3 Grms/ 5 ~ 500Hz/ operation (with SSD) |
| Anti-Shock | 50G, IEC 68-2-27, half sine, 11 ms duration (with SSD) |
| Certification | CE/FCC class A |